PART |
Description |
Maker |
21-0102 |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
Dallas Semiconducotr Dallas Semiconductor
|
SOT-89-3L |
SOT-89-3L PACKAGE OUTLINE DIMENSIONS SOT-89-3L PACKAGE OUTLINE DIMENSIONS
|
List of Unclassifed Manufacturers Electronic Theatre Controls, Inc.
|
SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
SOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-28 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|